Die-Size Shrink Scenario: Is the New Node Cheaper per Chip?
This lesson is part of the course
In this lesson
You shrink the HX-7 to 55 % of its area on a newer, dearer process and compare gross dies, yield, good dies and cost per good die in the first year and once the process has matured.
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Lessons in this course
- Wafer Area and Gross Dies per Wafer (with the Edge-Loss Term) Locked
- Defect Density and Poisson Yield e^(−A·D0) Locked
- Murphy and Negative-Binomial Yield vs Poisson (with a Yield Curve) Locked
- Cost per Good Die: Wafer Cost ÷ Good Dies Locked
- Test and Packaging Yield: Cost per Shipped Chip Locked
- Die-Size Shrink Scenario: Is the New Node Cheaper per Chip? Locked
- Binning: Speed-Grade Shares and Revenue per Wafer Month Locked
- Fab Utilisation and Wafer Starts per Month Locked